The MoA Signing Ceremony between ORS Technologies (ORSTECH) and SEGi University on 5 March 2024 marked a significant milestone in advancing engineering technology and education. With 40 attendees gathered in the VC room, the event commenced with a speech by Professor Sharon, highlighting ORSTECH’s pivotal role in the engineering simulation field since its establishment in 2007. She emphasized the importance of simulation in providing a safe and controlled environment for engineering students to learn and practice complex tasks and procedures. Through collaborating with ORSTECH, Professor Sharon aims to incorporate real-world applications into the classroom, underscoring ORSTECH’s commitment to innovation and education.
Shahrul from ORSTECH elaborated on the facilities and resources available to support students, emphasizing the value of professional certification and internships in enhancing their skills and employability. His speech highlighted ORSTECH’s dedication to nurturing the next generation of engineers and fostering a collaborative environment conducive to innovation and growth.
A highlight of the event was the unveiling of the collaborative project, “Performance of Brazed 3D Printed Nanostructured Copper Open Cell Foam Heat Exchanger.” This project showcases ORSTECH’s expertise in creating and developing 3D models and 3D printing, combined with SEGi’s role in optimizing the open cell foam heat exchanger design. This partnership exemplifies the synergy between industry and academia in addressing real-world engineering challenges.
The MoA signing ceremony symbolized the beginning of a fruitful partnership aimed at advancing engineering knowledge, technology, and education. This collaboration is expected to enhance the learning experience for SEGi students, providing them with access to cutting-edge simulation tools and practical applications that are crucial for their professional development.
According to a report by MarketsandMarkets, the global 3D printing market is projected to grow from USD 12.6 billion in 2020 to USD 34.8 billion by 2025, at a CAGR of 22.5%. This growth underscores the importance of integrating advanced technologies like 3D printing into engineering education. The partnership between SEGi and ORSTECH positions the university at the forefront of this technological advancement, preparing students for the rapidly evolving engineering landscape.
SEGi University’s commitment to excellence is further demonstrated through this collaboration, which aligns with its mission to provide students with industry-relevant education. By working closely with ORSTECH, SEGi ensures that its students are equipped with the knowledge and skills needed to excel in their careers.
As SEGi University and ORSTECH embark on this collaborative journey, they look forward to the innovative solutions and educational advancements emerging from this partnership. This alliance not only enhances the university’s academic offerings but also contributes to the broader goal of advancing engineering excellence in Malaysia.
